DMG/Mori Seiki Innovation Days Return to Chicago
March 28, 2011—
DMG/Mori Seiki USA has announced the annual Innovation Days event will take place at the company's headquarters and Chicago Technical Center on May 3-5, 2011 where machine technology will collide with the latest tooling, automation, software, training and application strategies. Manufacturers will have the opportunity to experience everything needed to stay at the forefront of manufacturing. This once‐yearly event gives machine tool users access to over thirty live cutting demonstrations and dozens of engineers specializing in advanced machining solutions. Technical seminars at the three‐day event will be presented by industry experts and span several productivity‐boosting topics including: Expanding Production, Shop Floor Networking & Communication, Machine Tools for the Future, Practical Strategies for Reducing Set Up Times and Laser and Ultrasonic Use In New Markets. Other presentations will encompass a wide variety of topics, including technical and new product seminars, as well as peer learning sessions. Cutting demonstrations will concentrate on the newest DMG and Mori Seiki equipment with process integration, automation and complex machining, as well as partner companies exhibiting tooling, software and accessories.
"We continue in the tradition of past Innovation Days by presenting the biggest event of the year," said Thomas R Dillon, president of DMG/Mori Seiki USA. "Visitors will have the chance to see how the outstanding results of our collaboration efforts continue to benefit them in every area, including technology, engineering solutions, training, service and parts."
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