JTEKT recently demonstrated a new double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today which grind to 3-4 microns, according to the company.
While the Greek proverb “the mills of the gods grind slowly, but they grind fine,” coined by Sextus Empiricus, was meant as a figurative expression of justice, it does hold true to gear grinding in the sense that there is a right way and a wrong way to do things because rushing the process only causes problems. Like justice, grinding takes the time it takes, but the grind is fine. So, the way to increase production, especially with the godlike largest gears, is to decrease nonproductive time with improved strategies.