Serial production of large gears requires a high level of quality, excellence, and continuity in production. Emphasis is placed on maximum synergy between the grinding machine, the grinding process, and the grinding wheel. After several successful trials on various Klingelnberg Höfler Rapid grinding machines carried out by Krebs & Riedel with customers in their production facilities, Krebs & Riedel has received several large orders for grinding large gears from abroad and has introduced the new premium grinding wheels with high process reliability.
JTEKT recently demonstrated a new double-disc horizontal grinder that simultaneously grinds both sides of silicon wafers to +/- 1 micron from as-sliced condition. The DXSG320 performance represents a massive improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today which grind to 3-4 microns, according to the company.